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题名Recent progress in silk fibroin-based flexible electronics
作者
发表日期2021-12-01
发表期刊Microsystems and Nanoengineering
ISSN2055-7434
卷号7
期号1
摘要

With the rapid development of the Internet of Things (IoT) and the emergence of 5G, traditional silicon-based electronics no longer fully meet market demands such as nonplanar application scenarios due to mechanical mismatch. This provides unprecedented opportunities for flexible electronics that bypass the physical rigidity through the introduction of flexible materials. In recent decades, biological materials with outstanding biocompatibility and biodegradability, which are considered some of the most promising candidates for next-generation flexible electronics, have received increasing attention, e.g., silk fibroin, cellulose, pectin, chitosan, and melanin. Among them, silk fibroin presents greater superiorities in biocompatibility and biodegradability, and moreover, it also possesses a variety of attractive properties, such as adjustable water solubility, remarkable optical transmittance, high mechanical robustness, light weight, and ease of processing, which are partially or even completely lacking in other biological materials. Therefore, silk fibroin has been widely used as fundamental components for the construction of biocompatible flexible electronics, particularly for wearable and implantable devices. Furthermore, in recent years, more attention has been paid to the investigation of the functional characteristics of silk fibroin, such as the dielectric properties, piezoelectric properties, strong ability to lose electrons, and sensitivity to environmental variables. Here, this paper not only reviews the preparation technologies for various forms of silk fibroin and the recent progress in the use of silk fibroin as a fundamental material but also focuses on the recent advanced works in which silk fibroin serves as functional components. Additionally, the challenges and future development of silk fibroin-based flexible electronics are summarized. [Figure not available: see fulltext.]

DOI10.1038/s41378-021-00261-2
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收录类别SCIE
语种英语English
WOS研究方向Science & Technology - Other Topics ; Instruments & Instrumentation
WOS类目Nanoscience & Nanotechnology ; Instruments & Instrumentation
WOS记录号WOS:000647734200001
Scopus入藏号2-s2.0-85105460590
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被引频次:170[WOS]   [WOS记录]     [WOS相关记录]
文献类型评论文章
条目标识符https://repository.uic.edu.cn/handle/39GCC9TT/9087
专题个人在本单位外知识产出
通讯作者Zhang, Xiaosheng
作者单位
1.School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu,611731,China
2.CIRMM,Institute of Industrial Science,The University of Tokyo,Tokyo,153-8505,Japan
3.Microsystems Laboratory,École Polytechnique Fédérale de Lausanne (EPFL),Lausanne,1015,Switzerland
4.Institute of Microelectronics,Peking University,Beijing,100087,China
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GB/T 7714
Wen, Danliang,Sun, Deheng,Huang, Penget al. Recent progress in silk fibroin-based flexible electronics. 2021.
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