发表状态 | 已发表Published |
题名 | Identification of technological structures using patent statistics |
作者 | |
发表日期 | 2003 |
发表期刊 | Economics of Innovation and New Technology
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ISSN/eISSN | 1043-8599 |
卷号 | 12期号:4页码:293-313 |
摘要 | This paper studies the use of patent statistics in identifying four aspects of technological structure, namely, the potential knowledge pool, cumulativeness, inter-firm homogeneity in technology levels, and the scope of innovations. The firms are sampled from the chemical (CHEM), the computer (COM) and the electrical and electronic (EE) industries worldwide. Using the proxies defined, we find that (i) the contributions of intra-industry spillover are low, at 12%, 10%, and 9% for the three industries respectively; (ii) they can internalize 15%, 19% and 13% of their previous research efforts respectively; and (iii) a positive relationship between knowledge spillover and technology overlap, and between scope of innovation and number of patents being cited in future. © 2003, Taylor & Francis Group, LLC. |
关键词 | Innovation Patent Citation Technological Structure |
DOI | 10.1080/1043859022000000826 |
URL | 查看来源 |
语种 | 英语English |
Scopus入藏号 | 2-s2.0-33847039234 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | https://repository.uic.edu.cn/handle/39GCC9TT/8432 |
专题 | 个人在本单位外知识产出 |
通讯作者 | Fung, Michael K. |
作者单位 | 1.Hong Kong Polytechnic University, Kowloon, Hong Kong, China 2.Department of Economics and Center for Economic Development,Hong Kong University of Science and Technology, Clearwater Bay, Kowloon, Hong Kong, China |
推荐引用方式 GB/T 7714 | Fung, Michael K.,Chow, William W. Identification of technological structures using patent statistics[J]. Economics of Innovation and New Technology, 2003, 12(4): 293-313. |
APA | Fung, Michael K., & Chow, William W. (2003). Identification of technological structures using patent statistics. Economics of Innovation and New Technology, 12(4), 293-313. |
MLA | Fung, Michael K.,et al."Identification of technological structures using patent statistics". Economics of Innovation and New Technology 12.4(2003): 293-313. |
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